2014 International Conference on Electronic Packaging Technology | ||
| Iraqi Journal of Applied Physics | ||
| Article 1, Volume 10, Issue 1, March 2014, Pages 32-32 | ||
| Authors | ||
| ; Electronic Manufacturing and Packaging Technology Society; ; of Chinese Institute of Electronics | ||
| Abstract | ||
| The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) will be held in Chengdu, China, from August 12 to 15, 2014. The ICEPT 2014 is organized by Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese Institute of Electronics (CIE) and co-organized by University of Electronic Science and Technology of China. As one of the most famous international conferences on electronic packaging technology, the conference has received strong support from IEEE CPMT and active involvement from IMAPS and iNEMI, and was highly appreciated by CIE and China Association for Science and Technology (CAST). | ||
| Keywords | ||
| Electronic Packaging Technology | ||
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